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As we speak, MediaTek launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs). Each chips borrow from MediaTek’s highly effective Dimensity 9000 platform. The brand new Dimensity 8000 collection makes use of TSMC’s 5nm manufacturing course of.
The Dimensity 8100 has 4 Arm Cortex-A78 cores working at speeds as much as 2.85GHz. The Dimensity 8000 additionally has 4 Cortex-A78 cores however reduces the highest velocity barely to 2.75GHz. Each chips embrace an Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0.
The brand new SoCs integrates MediaTek’s fifth-generation AI processing unit, APU 580. The 8000 collection platform is aimed to be the mid-tier to the Dimensity 9000’s Flagship tier.
The Dimensity 8000 chips embrace assist for as much as 200MP cameras and 4K60 HDR10+ movies. It features a main 3GPP R16-ready 5G modem to spice up sub-6Ghz efficiency utilizing 2CC Service Aggregation. It additionally makes use of MediaTek’s 5G UltraSave 2.0 for improved energy effectivity.
Additionally introduced at present is the 6nm Dimensity 1300. Powered by an octa-core CPU with an ultra-core Arm Cortex-A78 at 3GHz, three Arm Cortext A-78 tremendous cores, and 4 Arm Cortex A-55 effectivity cores. It additionally will get an Arm Mali-G77 GPU.
Smartphones powered by the MediaTek Dimensity 8000 and 1300 collection will likely be out there quickly.
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