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Samsung has introduced the supply of its HybridSubstrate Dice dubbed the H-Dice earlier in the present day, November 11. That is the South Korean tech firm’s newest 2.5D semiconductor packaging choice. Furthermore, it’s completely designed for information heart necessities, networking, AI merchandise, and HPC which calls for large-scale packaging expertise. SEMCO (Samsung ElectroMechanics) collaborated with Amkor Expertise to develop the H-Dice answer.
The H-Dice answer is a good selection for high-performance semiconductors that require the combination of a number of chips, based on Moonsoo Kang. Kang is the senior vp and head of Samsung’s Foundry Enterprise Mannequin Staff. Furthermore, Kang assures that Samsung can be supplying a number of packaging choices in a bid to resolve points the corporate’s purchasers face. The corporate might want to increase and improve its foundry ecosystem to realize this, Kang added.
Samsung Broadcasts H-Dice Resolution
The 5D package deal is available in a compact type issue, permitting customers to put in HBM (excessive bandwidth reminiscence) or logic chips above silicon dietary supplements. The Samsung H-Dice system contains a hybrid platform, coupled with a positive pitch platform that may positive bump connections and is able to HDI (high-density interconnection). This enables large sizes to suit inside a 2.5D packaging. Apart from that, large-area packaging turns into extra vital as the amount and dimension of chips inside a package deal will increase.
Moreover, it is very important have high-speed broadband communication. Additionally, fine-pitch substrates are vital however the costs enhance as the scale will increase, based on a weblog publish on Samsung Newsroom. If six or extra HBMs are put collectively, it’s more durable to create an enormous substrate. Because of this, the effectivity reduces. The Korean tech behemoth solved this downside with the assistance of a hybrid substrate construction, which kinds a mix of simply processable HDI substrates and a high-end fine-pitch platform over an enormous expanse.
Different Important Data
When the solder ball pitch reduces by 35 p.c, the fine-pitched platform’s dimension is prone to scale back. The solder ball pitch electrically hyperlinks the platform and the chip. In the meantime, an HDI substrate (PCB module) can come beneath the positive pitch substrate get interplay with the board system. Apart from that, the H-Dice answer’s dependability can enhance by using Samsung’s energy and sign integrity evaluation expertise. This expertise helps ship regular energy with out inflicting distortion or sign loss whereas piling up a number of HBM and logical chips.
Apart from enhancing the H-Dice answer’s reliability, Samsung’s proprietary sign/energy integrity evaluation expertise assures a steady provide of energy. Samsung is presently gearing as much as maintain its third SAFE (Annual ‘Samsung Superior Foundry Ecosystem) Discussion board. The occasion will kick off just about on November 17 (PST).
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